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KEATIN® lead-free
KEATIN® advanced solder bar
KEATIN® advanced solder bar
SAC305 and SAC0307 solder bar
High yield
Minimal investment and process costs
Fast wetting improves solderability, performs better than all Sn/Cu alloys
Excellent flow behavior, minimized bridging
Low dross formation reduces maintenance and solder consumption
High mechanical reliability of the joint
Reduced cracking due to reduced solidification forces
Bad solders also available as solid wire on request
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Type
Sn96.5Ag3Cu0.5
Sn97Ag3
Sn99.7Ag0.3
Sn99Ag0.3Cu0.7
Type
SAC 0300 / Sn99,7Ag0,3
SAC 0307 / Sn99Ag0,3Cu0,7
SAC 300/ Sn97Ag3
SAC 305 / Sn96,5Ag3Cu0,5
Weight
0.2 kg ingot
1.0 kg ingot
3.5 kg bar with eyelet
PU
20 kg
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