KETIN® Sn62Pb36Ag2 solder paste KPF 01 XL1

• KPF 01 XL1, ISO 9454 1.1.2.C / IEC61190-1-1 ROL1
• Formulated for fine-pitch stencil printing, with aperture from 0.5 mm diameter to flip-chip and 0201 applications
• Excellent printing results and fewer soldering defects after longer downtimes
• High speed printing speeds up to 150mm/sec.
• Efficient activator system that enables defect-free soldering with a wide range of reflow profiles
• Low flux residue with minimal spread for reliable underfill procedures and results
• Excellent soldering properties with excellent reliability
• Melting point: 179 °C

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